Application
Notes
Eye Protection
LEDs are very
bright. DO NOT look directly into the LED light!!
The
light can be intense enough to injure human eyes.
Basics On
LEDs
How does a LED
work? This is a very simple explanation of the construction and
function of LEDs. White LEDs need 3.6VDC and use approximately
30 milliamps of current, a power dissipation of 100 milliwatts.
The positive power is applied to one side of the LED semiconductor
through a lead (1 anode) and a whisker (4). The other side of the
semiconductor is attached to the top of the anvil (7) that is the
negative power lead (2 cathode). It is the chemical makeup of the
LED semiconductor (6) that determines the color of the light the
LED produces. The epoxy resin enclosure (3 and 5) has three functions.
It is designed to allow the most light to escape from the semiconductor,
it focuses the light (view angle), and it protects the LED semiconductor
from the elements.
As you can see, the entire unit is totally embedded in epoxy. This
is what make LEDs virtually indestructible. There are no loose or
moving parts within the solid epoxy enclosure.
Therefore, a
light-emitting diode (LED) is essentially a PN junction semiconductor
diode that emits light when current is applied. By definition,
it is a solid-state device that controls current without heated
filaments and is therefore very reliable. LED performance is based
on a few primary characteristics:
Color
LEDs are highly
monochromatic, emitting a pure color in a narrow frequency range.
The color emitted from an LED is identified by peak wavelength
(lpk) and measured in nanometers (nm ).

Peak wavelength
is a function of the LED chip material. Although process variations
are ±10 NM, the 565 to 600 NM wavelength spectral region
is where the sensitivity level of the human eye is highest. Therefore,
it is easier to perceive color variations in yellow and amber LEDs
than other colors.
LEDs are made
from gallium-based crystals that contain one or more additional
materials such as phosphorous to produce a distinct color. Different
LED chip technologies emit light in specific regions of the visible
light spectrum and produce different intensity levels.
Comparison of chip technologies for wide-angle,
non-diffused LEDs
|
LED
Color
|
Standard Brightness |
High Brightness |
Chip
Material |
lpk
(NM) |
Iv
(mcd) |
Viewing
Angle |
Chip
Material |
lpk
(NM) |
Iv3
(mcd) |
Viewing
Angle |
|
Red
|
GaAsP/GaP
|
635
|
120
|
35
|
AS
AlInGaP
|
635
|
900
|
30
|
|
Orange
|
GaAsP/Gap
|
605
|
90
|
30
|
AS
AlInGaP
|
609
|
1,300
|
30
|
|
Amber
|
GaAsP/Gap
|
583
|
100
|
35
|
AS
AlInGaP
|
592
|
1,300
|
30
|
|
Yellow
|
Gap
|
570
|
160
|
30
|
--
|
--
|
--
|
--
|
|
Green
|
Gap
|
565
|
140
|
24
|
GaN
|
520
|
1,200
|
45
|
|
Turquoise
|
--
|
--
|
--
|
--
|
GaN
|
495
|
2,000
|
30
|
|
Blue
|
--
|
--
|
--
|
--
|
GaN
|
465
|
325
|
45
|
White Light
When light
from all parts of the visible spectrum overlap one another,
the additive mixture of colors appears white. However, the
eye does not require a mixture of all the colors of the spectrum
to perceive white light. Primary colors from the upper, middle,
and lower parts of the spectrum (red, green, and blue), when
combined, appear white. To achieve this combination with
LEDs requires a sophisticated electro-optical design to control
the blend and diffusion of colors. Variations in LED color
and intensity further complicate this process.
Presently
it is possible to produce white light with a single LED using
a phosphor layer (Yttrium Aluminum Garnet) on the surface of
a blue (Gallium Nitride) chip. Although this technology produces
various hues, white LEDs may be appropriate to illuminate opaque
lenses or backlight legends. However, using colored LEDs to
illuminate similarly colored lenses produces better visibility
and overall appearance.
Intensity
LED light
output varies with the type of chip, encapsulation, efficiency
of individual wafer lots and other variables. Several LED
manufacturers use terms such as "super-bright," and "ultra-bright" to
describe LED intensity. Such terminology is entirely subjective,
as there is no industry standard for LED brightness.
The
amount of light emitted from an LED is quantified by
a single point, on-axis luminous intensity value (Iv).
LED intensity is specified in terms of millicandela (mcd).
This on-axis measurement is not comparable to mean spherical
candlepower (MSCP) values used to quantify the light
produced by incandescent lamps. |
Luminous
intensity is roughly proportional to the amount of current
(If) supplied to the LED. The greater the current, the higher
the intensity. Of course, there are design limits. Generally,
LEDs are designed to operate at 20 milliamps (mA). However,
operating current must be reduced relative to the amount of
heat in the application. For example, 6-chip LEDs produce more
heat than single-chip LEDs. 6-chip LEDs incorporate multiple
wire bonds and junction points that are affected more by thermal
stress than single-chip LEDs. Similarly, LEDs designed to operate
at higher design voltages are subject to greater heat. LEDs
are designed to provide long-life operation because of optimal
design currents considering heat dissipation and other degradation
factors.
Eye Safety Information
The need
to place eye safety labeling on LED products is dependent upon
the product design and the application. Only a few LEDs produce
sufficient intensity to require eye safety labeling. However,
for eye safety, do not stare into the light beam of any LED
at close range
Visibility
Luminous
intensity (Iv) does not represent the total light output
from an LED. Both the luminous intensity and the spatial
radiation pattern (viewing angle) must be taken into account.
If two LEDs have the same luminous intensity value, the lamp
with the larger viewing angle will have the higher total
light output.
Theta
one-half (q½) is the off-axis angle where the
LED's luminous intensity is half the intensity at direct
on-axis view. Two times q½ is the LEDs' full viewing
angle; however, light emission is visible beyond the
q½ point. Viewing angles listed in this catalog
are identified by their full viewing angle (2q½ °).
LED
viewing angle is a function of the LED chip type and the
epoxy lens that distributes the light. The highest luminous
intensity (mcd rating) does not equate to the highest visibility.
The light output from an LED chip is very directional.
A higher light output is achieved by concentrating the
light in a tight beam. Generally, the higher the mcd rating,
the narrower the viewing angle.
The
shape of the encapsulation acts as a lens magnifying the
light from the LED chip. Additionally, the tint of the
encapsulation affects the LED's visibility. If the encapsulation
is diffused, the light emitted by the chip is more dispersed
throughout the encapsulation. If the encapsulation is non-diffused
or water clear, the light is more intense, but has a narrower
viewing angle. Non-diffused and water clear LEDs have identical
viewing angles; the only difference is, water clear encapsulations
do not have a tint to indicate color when the LED is not
illuminated. |
Overall visibility
can be enhanced by increasing the number of LED chips in the
encapsulation, increasing the number of individual LEDs, and
utilizing secondary optics to distribute light. To illustrate,
consider similar red GaAlAs LED chip technology in four different
configurations:
In each case,
the amount of visible light depends on how the LED is being
viewed. The single chip may be appropriate for direct viewing
in competition with high ambient light. The 6-chip may be better
suited to backlight a switch or small legend, while the cluster
or lensed LED may be best to illuminate a pilot light or larger
lens.
Operating Life
Because LEDs
are solid-state devices they are not subject to catastrophic
failure when operated within design parameters. DDP® LEDs
are designed to operate upwards of 100,000 hours at 25°C
ambient temperature. Operating life is characterized by the
degradation of LED intensity over time. When the LED degrades
to half of its original intensity after 100,000 hours it is
at the end of its useful life although the LED will continue
to operate as output diminishes. Unlike standard incandescent
bulbs, DDP® LEDs resist shock and vibration and can be
cycled on and off without excessive degradation.
Voltage/Design Current
LEDs are
current-driven devices, not voltage driven. Although drive
current and light output are directly related, exceeding the
maximum current rating will produce excessive heat within the
LED chip due to excessive power dissipation. The result will
be reduced light output and reduced operating life.
LEDs that
are designed to operate at a specific voltage contain a built-in
current-limiting resistor. Additional circuitry may include
a protection diode for AC operation or full-bridge rectifier
for bipolar operation. The operating current for a particular
voltage is designed to maintain LED reliability over its operating
life.
Precautions
While Working With LEDs
General
We cannot
assume any responsibility for any accident or damage caused
when the products are used beyond the maximum ratings specified
herein.
The user
of these products must confirm the performance of the LEDs
after they are actually assembled into the user's products/systems.
It is strongly advised that he user design fail-safe products/systems.
We will not be responsible for legal matters which are caused
by the malfunction of these products/systems.
LED Lamps
Static Electricity and Surge
Static electricity
and surge damage LEDs. It is recommended to use a wrist band
or anti-electrostatic glove when handling the LEDs. All devices,
equipment and machinery must be electrically grounded.
Lead
Forming
The leads
should be bent at a point at least 3mm from the epoxy resin
of the LEDs.
Bending should
be performed with the base firmly fixed by means of a jig or
radio pliers.
Mounting Method
The leads
should be formed so they are aligned exactly with the holes
on the PC board. This will eliminate any stress on the LEDs.
Use LEDs
with stoppers or resin spacer to accurately position the LEDs.
The epoxy resin base should not be touching the PC board when
mounting the LEDs. Mechanical stress to the resin may be caused
by the warping of the PC board when soldering.
The LEDs
must not be designed into a product or system where the epoxy
lens is pressed into a plastic or metal board. The lens part
of the LED must not be glued onto plastic or metal. The mechanical
stress to the leadframe must be minimized.
Soldering
Solder the
LEDs no closer than 3mm from the base of the epoxy resin.
For solder
dipping, it may be necessary to fix the LEDs for correct positioning.
When doing this, any mechanical stress to the LEDs must be
avoided.
When soldering,
do not apply any mechanical force to the leadframe while heating.
Repositioning
after soldering must be avoided.
Soldering conditions:
| |
Soldering
Iron |
Dip
Soldering |
Reflow
Soldering |
| Lamp
LED |
300degC(max),
3sec(max) |
260degC(max),
5sec(max) |
Not
allowed. |
| Chip
LED |
300degC(max),
3sec(max) with Twin Head iron |
Not
allowed. |
 |
Cleaning
Avoid exposure
to chemicals as they may attack the LED surface and cause discoloration.
When washing is required, "isopropyl alcohol" is
to be used.
The influence
of ultrasonic cleaning on the LEDs differs depending on factors
such as oscillator output and the way in which the LEDs are
mounted. Therefore, ultrasonic cleaning should only be performed
after making certain that it will not cause any damage.
Emission
color
LED emission
wavelengths vary. LEDs are classified by emission color into
different ranks. When a large volume of LEDs are purchased,
LEDs with different color ranks will be delivered
Packaging
The leadframes
of the LEDs are coated with silver. Care must be taken to maintain
a clean storage atmosphere. If the LEDs are exposed to gases
such as hydrogen sulfide, it may cause discoloration of the
leadframes.
Moistureproof
packing is used to keep moisture away from the chip type LEDs.
When storing chip type LEDs, please use a sealable package
with a moisture absorbent material inside.
LED Cluster Lamp and LED Dot Matrix Unit
Assembly
Please refer
to the recommended distance between the leads when designing
lead holes on the PC board.
Close attention
must be paid on the correct positioning of O-rings and other
water proof seals when assembling products/systems.
LEDs are
vulnerable to static electricity. When handling the LEDs, necessary
precautions regarding static electricity must always be taken
into consideration.
Installation of LEDs
Make certain
that the lead position and polarity are correct when installing
the LEDs.
The interface
cable must be as short as possible.
The power
supply and ground line must be selected according to their
current capacity.
Heat
Dissipation
When many
LEDs are mounted into a small area, heat generation must be
taken into consideration. If there is a possibility that the
ambient temperature may exceed 60 degrees centigrade, some
kind of forced cooling system will be needed
The ambient
operating temperature must be taken into consideration when
a product/ system is being designed. There are certain limits
to maximum current, at certain temperatures which must be kept
in mind.
Handling
When the
surface of the LEDs must be cleaned, the LEDs should be wiped
softly with detergent. The surface may be damaged and the effect
of the lens may be reduced with violent scrubbing.
Others
EMI countermeasures
must be taken as a system.
When instantaneous
power failure, or a current surge by lightning stops the controller
at abnormal conditions, the abnormally high electric current
may continue running through the LEDs for an extended period
of time. This can damage the LEDs in the system. Circuit protection
against abnormally high current must be built into the system
to protect against this.
Disclaimer: The
information provide herein is basic information on the operating
properties and user characteristics of LEDs. We do not imply
that the information is accurate or applicable to every aspect
of LED usage. Each application will need to be assessed on
its own merits and different applications will require different
solutions. We do not dispense engineering advice and advise
all users to seek professional advice and solutions before
constructing LED applications in particular to ensure that
specific products match the application requirements and that
construction methods comply with best professional practice.
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